Optoelectronic module and plug arrangement

ABSTRACT

A compact optoelectronic module that prevents undesirable heating by locating the electrical drive and/or receiving (control) circuit outside of the housing containing the optoelectronic transducer. The control circuit is mounted on a submount (PCB). The housing is mounted on the submount adjacent to the control circuit, and the optoelectronic transducer is coupled to the control circuit via a mount (leadframe) that extends substantially perpendicular to the submount plane and is surface mounted on the submount. The housing includes an opening, and a lens is provided between the optoelectronic transducer and the opening and defines an optical axis that is parallel to the submount plane. An encapsulating body is used to secure the optoelectronic transducer and mount inside the housing, and a portion of the encapsulating material is used to form the lens.

FIELD OF THE INVENTION

The invention relates generally to optoelectronic modules, and moreparticularly to a plug arrangement used in conjunction with anoptoelectronic module. One preferred field of application of theinvention is low-cost optoelectronic modules which are coupled to POF(Plastic Optical Fiber) optical waveguides. Within this preferred fieldof application, the invention is particularly suitable for use inmultimedia networks, in the in-house area and automotive area.

BACKGROUND OF THE INVENTION

DE 199 09 242 A1 discloses an optoelectronic module in which a mountwith an optoelectronic transducer is positioned in a module housing andis encapsulated by means of a translucent material which can be shaped.The light is injected or output via an optical fiber, which is coupledto a connecting stub on the module housing. The driver module and thereceiving module for the optoelectronic transducer are also located onthe mount.

The data rates for POF transmission systems are rising increasingly.So-called RCLEDs (Resonant Cavity LEDs) with data rates of up to 500Mbit/s are thus being used increasingly. These RCLEDs have thedisadvantage that they have a resonant-like behavior in the temperaturerange from about −40° C. to 85° C. In particular, there is aconsiderable reduction in power at the upper temperature limit. Thesereductions in power can be decreased by circuitry measures on the drivermodule.

In the case of transceiver embodiments in which the driver module isencapsulated in the encapsulation body with the RCLED, it is, however,impossible to implement appropriate circuitry measures. Firstly, it isdifficult to additionally accommodate the external circuitry in theencapsulation body and to carry out the wiring. Secondly, a large amountof heat is developed, because the driver stage and the opticaltransmission source draw more current at high data rates, and because ofthe additional external circuitry. This heating can lead to clouding orblackening of the encapsulation body, and to destruction of thetransducer module.

The only known way until how to reduce undesirable heating has been torestrict the temperature range to 0° C. to about 60° C. Externalcircuitry which reduces the reductions in the power of the transducermodule are also dispensed with in the case of transducer modules whichare encapsulated in an encapsulation body. Obviously, this is notsatisfactory.

U.S. Pat. No. 5,768,456 describes an optoelectronic module having atransmitting and/or receiving element which is arranged on a flexiblesubstrate. The flexible substrate is connected to-a printed circuitboard. A holding is provided for holding an optical waveguide which canbe coupled to the transmitting and/or receiving element, and theholder-is likewise arranged on the printed circuit board.

U.S. Pat. No. 5,259,052 discloses an optical plug arrangement, in whichan optical plug has a protective bracket which can be moved in thelongitudinal direction with respect to the optical waveguides. Duringinsertion of the optical plug into a plug housing, the protectivebracket is moved relative to the optical waveguides, so that theyproject beyond the protective bracket.

SUMMARY OF THE INVENTION

The present invention is directed to an optoelectronic module which isdistinguished by being physically compact. The aim in this case is toprevent undesirable heating caused by electrical circuits. A further aimis to provide a plug arrangement for POF transmission systems, whichallows optical fibers to be connected to an optoelectronic module.

Accordingly, provision is made that, in the case of an optoelectronicmodule, the electrical drive and/or receiving circuit is arrangedoutside the holding and coupling part for the transmitting and/orreceiving element, to be precise on a submount which lies on a planewhich runs parallel to the longitudinal axis of the coupling area. Themount for the optoelectronic module on which the transmitting and/orreceiving element is arranged in this case runs at right angles to thesubmount. The separation of the optical transducer (transmitting and/orreceiving element) from the electrical circuitry allows each of thesecomponents to be optimized individually. In this case, only thetransmitting and/or receiving element and, possibly additionally amonitor diode are/is accommodated in the holding and coupling part. Thetransmitting and/or receiving element is sheathed by an encapsulationmaterial.

This results in a small, transparent encapsulation body, which has alargely homogeneous expansion behavior. Only minor stresses occur in theencapsulation body over the maximum temperature range from −40° C. to+85° C., as is required in automotive applications, thus considerablyimproving the fatigue life.

The arrangement of the submount parallel to the longitudinal axis oroptical axis of the coupling area allows the submount to be arrangeddirectly on a main circuit board. The submount together with theelectrical drive and/or receiving circuit in this case represents a unitwhich can be tested in advance. It should be mentioned that theelectrical drive and/or receiving circuit may also have the additionalelectrical circuitry mentioned initially, in addition to the actualtransducer module or receiving module, thus making it possible to reducethe resonant-like behavior of the transducer module, in particular of anRCLED.

In one preferred refinement of the invention, the holding and couplingpart forms a cylindrical cutout, one of whose ends contains thetransmitting and/or receiving element, and whose other end forms thecoupling area for an optical fiber. The holding and coupling part isaccordingly essentially a cylinder, at one of whose ends thetransmitting and/or receiving element is arranged in the encapsulationmaterial, and whose other end is used to hold an optical fiber. Theoptical axis of the transmitting and/or receiving element is in thiscase located on the longitudinal axis of the cylinder or coupling area.The inner wall of the cylinder is used in a simple manner for passivefiber guidance and for fixing the fiber with respect to transversedeflections.

The mount for the transmitting and/or receiving element is preferably aleadframe, which provides the electrical link for the transmittingand/or receiving element (in particular by means of bonding wiresbetween the individual contacts of the leadframe and the transmittingand/or receiving element). The leadframe is in this case electricallyconnected to the submount, and for this purpose has an area at one ofits ends which is bent through 90° and is mounted on the submount. Atleast in the area of the holding and coupling part, the leadframepreferably runs at right angles to the longitudinal axis of the couplingarea or to the plane on which the submount is arranged.

The encapsulation material in the holding and coupling part preferablyforms an integrated lens on the side facing the coupling area. For thispurpose, a filling closure is inserted into the coupling area before thefilling process, on whose end surface the coupling lens is formed innegative form. Once the holding and coupling part has been filled withthe encapsulation material and the material has been cured, the fillingclosure is removed again, with the desired coupling lens beingintegrated in the encapsulation material.

The integrated form of a lens in the encapsulation body increases theinjected transmission power and the received power which is imaged on areceiving element.

A fiber stop ring is furthermore preferably provided in theencapsulation material around the lens in order to prevent the endsurface of an optical fiber which is inserted into the coupling areabeing able to touch the lens apex of the lens. The fiber stop ring alsoleads to positioning in the longitudinal direction of the coupling area,thus resulting in fiber guidance on all three spatial axes.

In one preferred refinement of the invention, the optoelectronic moduleis mechanically coupled to a plug holder. The coupling is in this caseprovided via the outer wall of the holding and coupling part.Self-coupling structures may be provided in this case, allowing simpleand automatic coupling between the holding and coupling parts and theplug housing. During insertion of a plug into the plug holder, thecorresponding optical fiber is inserted into the coupling area of theholding and coupling part.

It is also possible to provide for the module to be mechanically coupledto a naked fiber adaptor. The optical fiber is in this case, forexample, firmly clamped by means of clamp in an area of the naked fiberadaptor which is in the form of a trough. It is also possible to providefor the naked fiber adaptor to be formed integrally with the holding andcoupling part, and to be formed by an extension of the cylindricalcoupling area of the holding and coupling part. The arrangement of anaked fiber adaptor represents a physically simple and low-cost variantfor coupling the optical fiber to the optoelectronic module.

In a further preferred refinement of the invention, the submount can bemounted on a main circuit board, in particular by SMD mounting. The maincircuit board is in this case preferably used as a heat sink for thesubmount and for the electrical modules arranged on it. For thispurpose, the submount preferably has plated holes which, in addition toelectrical connection, also provide heat conduction between theelectrical components on the submount and the main circuit board. Solderpad contacts are provided in particular on the lower face of thesubmount, via which the submount is mounted by SMD mounting on the maincircuit board.

Lithographic circuit wiring techniques allow the electrical submount tobe very compact, so that the entire transceiver structure has a width ofless than 13.5 mm and thus satisfies the industry criterion of a “smallform factor”. The submount and the holding and coupling part arearranged alongside one another or else one above the other on the maincircuit board, with the holding and coupling part possibly being held byfurther structures such as a plug housing.

The holding and coupling part and/or the submount preferably have/hasself-coupling structures which allow automatic adjustment between theseparts and/or with respect to a main circuit board. Correspondingstructures may also be provided on a-plug housing or on a naked fiberadaptor.

The electrical contacts on the lower face of the submount are preferablydesigned such that they are as far apart from one another as possible,for example being offset. This makes it possible to design a plughousing or a naked fiber adaptor, to which the holding and coupling partis connected, with clamping structures on the lower face such that themodule is fixed by the optoelectronic module being latched in on a maincircuit board such that the solder connections between the submount andthe main circuit board are already pre-adjusted. The module is finallyfixed on the main circuit board in a subsequent soldering process.

The lower face of the submount and of the plug housing and/or of a nakedfiber adaptor are thus designed such that plugging the module onto amain circuit board leads to precise initial adjustment, and the modulecan be fixed in a subsequent soldering process without any badelectrical contacts occurring.

In one preferred refinement, a housing cover is provided, whichsurrounds the submount and/or one end of the holding and coupling part.For electromagnetic shielding, the holding and coupling part and/or theabovementioned housing cover are/is provided with an electricallyconductive layer. Alternatively, the holding and coupling part and/orthe housing cover are/is composed of an electrically conductive plasticmaterial which, by way of example, is produced by adding smallelectrically conductive balls to the plastic, and which is known per se.

The housing cover of the holding and coupling part as well as the groundlayer on the submount form a cage, which prevents or greatly reducesincident interference radiation.

In a further refinement of the invention, the holding and coupling partis in the form of a double chamber, which has a transmitting element anda receiving element in parallel, separate areas. Each of these parallelareas in turn has its own coupling area, via which an optical fiber isconnected. In this refinement, two submounts are preferably provided,one submount in each case for the transmitting element and one submountfor the receiving element. A common housing cover, which is providedwith an electrically conductive layer, in this case preferably separatesthe two submounts, thus preventing electrical crosstalk.

A second aspect of the invention provides a plug arrangement with a plughousing and a housing associated with the plug. The plug arrangement isparticularly suitable in conjunction with the optoelectronic module asclaimed in claim 1, with the external contour of the holding andcoupling part being coupled to the plug holder.

On the basis of the solution according to the invention, the plug has aprotective bracket which can move relative to the housing of the plug,and which has at least one opening for an optical fiber in the plug.When it is not inserted, the protective bracket is arranged asprotection in front of the optical fiber which projects out of the plughousing.

The plug housing which can be coupled to the plug has three steps, inthat it has three areas whose internal diameters differ, between which afirst and a second step stop are formed, with the first step stop on theplug housing acting as a stop for the protective bracket, so that theprotective bracket is moved from the locking position to the first stepstop during insertion of the plug into the plug housing, and is moved inthe direction of the housing, with the at least one optical fiberprojecting out of the corresponding opening in the protective bracket.The second step stop is used as a stop for the end face of the housingof the plug.

The arrangement of a protective bracket allows “blind” insertion, as isfrequently required in automotive designs, and which in the processprotects the fiber end surface against dirt.

The so-called “Kuchiri” criterion is known for this purpose: the fiberis protected in a type of “scabbard” (Japanese: Kuchiri) such that thefiber cannot project out of the protective environment until the plughas been introduced into the plug housing, so that it is positioned infront of the appropriate transducer without becoming dirty.

The plug preferably has two optical fibers, whose center axes areseparated by 5 mm. The plug in this case preferably has a width of 13.5mm, so that it satisfies the industry “small form factor” standard.

The protective bracket is preferably attached to the plug housing bymeans of attachment arms, with the attachment arms being mounted on theplug housing such that they are sprung and can be moved. By way ofexample, two such attachment arms are provided and project at rightangles from that surface of the protective bracket which is arranged infront of the ends of the optical fibers.

In this case, the latching arms may have latching elements, via whichthe plug can be latched in the plug housing.

BRIEF DESCRIPTION OF THE FIGURES

The invention will be explained in more detail in the following textusing a number of exemplary embodiments and with reference to thefigures of the drawing, in which:

FIG. 1 shows a first exemplary embodiment of an optoelectronic module,in the form of a section illustration;

FIG. 2 shows the exemplary embodiment shown in FIG. 1, with the modulebeing coupled to a plug housing;

FIG. 3 shows a second exemplary embodiment of an optoelectronic modulewhich is coupled to a plug housing;

FIG. 4A shows a third exemplary embodiment of an optoelectronic module,in which the module is coupled to a naked fiber adaptor;

FIG. 4B shows a cross section through the module shown in FIG. 4A;

FIG. 5 shows a fourth exemplary embodiment of an optoelectronic module,with the module forming a naked fiber adaptor;

FIG. 6A shows a perspective view of the plug of a plug arrangement forPOF transmission systems;

FIG. 6B shows a section view of the plug shown in FIG. 6A;

FIG. 6C shows a plan view of the locking apparatus between the plug andplug housing shown in FIG. 6B;

FIG. 7 shows a section view of a plug housing of a plug arrangement fora POF transmission system;

FIG. 8 shows the connection between a plug as shown in FIGS. 6A, 6B anda plug housing as shown in FIG. 7 in a position in which the plug hasnot yet been completely inserted into the plug housing;

FIG. 9 shows a plug arrangement as shown in FIG. 8, with the plug havingbeen completely inserted into the plug housing;

FIG. 10 shows an optoelectronic module as shown in FIG. 1, connected toa plug arrangement as shown in FIGS. 6 to 9, and

FIG. 11 shows an optoelectronic module as shown in FIG. 3, connected toa plug arrangement as shown in FIGS. 6 to 9.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

FIG. 1 shows an optoelectronic module 1 whose main components are aholding and coupling part 2, which is also referred to as a CAI (CavityAS Interface) housing, and a submount 3 with electrical components. Thearrangement of the CAI housing 2 and submount 3 is covered by a housingcover 4. The housing cover is connected to the CAI housing 2 in aninterlocking manner via a projection 41.

The CAI housing 2 is used firstly for holding and for insertion of amount (lead structure) 5 with a transmitting and/or receiving element,which is in this case an optoelectronic transducer 6, and secondly forforming a coupling area 27 for holding an optical fiber. For thispurpose, at one of its ends, the CAI housing has an encapsulation body21 composed of transparent encapsulation material, which sheaths(secures) the mount 5 together with the optoelectronic transducer 6,which may be in the form of a transmitting element or a receivingelement.

On the one hand, a lens 22 is integrated in one piece in the transparentencapsulation body 21 in order to increase the light transmission powerwhich can be injected into an optical fiber by means of a transmittingelement or to increase the received light power imaged onto to aphotodiode.

Furthermore, the encapsulation body 21 forms a fiber stop ring orprotective ring 23, which protects the integrated lens 22 against beingadversely mechanically affected by touching the fiber.

The CAI housing 2 is essentially in the form of a cylinder 24, whichsurrounds a cylindrical cutout (opening) 25. The encapsulation body 21is located at one end of the cylindrical cutout. The area 27 of thecylindrical cutout which is adjacent to it is used together with theinner wall 28 of the cylinder 24 for passive guidance and for fixingwith respect to transverse deflections of an optical fiber which can beinserted into the cylindrical cutout 25.

The transmitting and/or receiving element 6 is in this case centeredwith respect to (i.e., intersects) the optical axis 29 of the CAIhousing.

The mount 5 is in the form of a leadframe which is aligned at rightangles to the optical axis 29 and is soldered at its lower end 51 (whichis bent through 90°) by means of an SMD contact to the submount 3.

Self-adjustment markings 61, 62 are furthermore provided on the CAIhousing and on the submount and are used for self-adjustment andcoupling of the CAI housing 2 to the submount 3 and, respectively, to aplug housing which is coupled to the outer wall of the CAI housing 2(see FIG. 2).

The submount 3 is a printed circuit board which has at least two layersand contains external circuitry 31 as well as an IC driver module or areceiving module (control circuit) 32. The external circuitry 31 is usedfor power optimization, and is used in particular when RCLEDs are usedas transmitting elements.

The submount 3 has two or more plated holes 33 to solder pad contacts 34on the lower face of the submount, via which the submount can bearranged on a main circuit board (see FIG. 2). Very good heatdissipation takes place by means of the plated holes 33 from thetransmitting module or receiving module 32 to a main circuit mount,which is used as heat sink that is coupled to the submount 3.

All of the pad contacts 34 are formed on the lower face of the submount.There is an offset between the contacts 34, so that they are verycompact with respect to one another while at the same time being as faraway from one another as possible. Additional adjustment pins,advantageously at ground potential, may optionally be provided, andensure that the submount fits precisely into a main circuit mount.

The submount 3 runs on a plane which is arranged parallel to the opticalaxis 29 of the CAI housing.

The CAI housing 2 and the housing cover 4 have a metallically conductivesurface which, together with the ground layer on the submount, providesEMC shielding.

For this purpose, it is feasible for the CAI housing 2 and the housingcover 4 to be formed from an electrically conductive plastic material.

FIG. 2 shows the optoelectronic module from FIG. 1 in conjunction withan SMI plug arrangement for plastic fiber transmission paths. SMI isshort for “small multimedia interface” and is a conventional standard inthe in-house field.

However, in principle, other plug systems may also be used inconjunction with the optoelectronic module 1, in particular the plugsystem which is explained in the following text with reference to FIGS.6 to 9.

The SMI plug housing 71 is plugged onto the cylinder 24 on the CAIhousing 2. The figure shows a plan view of the inserted plug 72. As canbe seen, a fiber 73, which is guided in the plug 72, is inserted intothe cylindrical holding opening 25 in the CAI housing 2, and its endsurface makes mechanical contact with the fiber stop ring 23 on theencapsulation body 21.

It should be mentioned that the plug housing 71 is arranged on a maincircuit mount 8 on which the submount 3 is also located. The plughousing 71 in this case latches into the main circuit mount 8 vialatching elements 71 a.

As can also be seen, the self-adjustment marking 61 is used forconnection and passive adjustment between the CAI housing 2 and the plughousing 71.

In this context, it should be mentioned that the CAI housing 2 has aside opening 2 a, through which the mount 5 can be inserted togetherwith the transmitting and/or receiving element 6 into the CAI housing 2.

The CAI housing is also filled with encapsulation material via thisopening 2 a. While the CAI housing 2 is being filled with encapsulationmaterial, a filling closure is inserted into the holding opening 25, andis removed again once the encapsulation material has cured. This fillingclosure is a negative of the shape of the lens 22 which is associatedwith the transmitting and/or receiving element 6.

The exemplary embodiment in FIG. 3 shows an alternative refinement of anoptoelectronic module 1′ connected to a plug housing 71′. In thisrefinement, the submount 3 is placed underneath the CAI housing 2, andon the lower face of the plug housing 71′.

In order to create sufficient space on the lower face, the height of theplug housing 71 in this case had to be adapted, that is to say thedistance between the optical axis 29 and the main circuit mount 8 issomewhat enlarged. However, in comparison to the exemplary embodimentshown in FIGS. 1 and 2, the overall physical length of theoptoelectronic module 1′ is considerably reduced.

The lower face 71 a′ of the plug housing 71′ is metalized, so as toprovide EMC shielding for the electronic components 32 and 31.

It should be mentioned that the lower end 51 of the mount 5 is bent upin the other direction in this refinement.

The CAI housing 2 is fixed on the plug housing 71′ by means, forexample, of a clamp 71 b′ on the plug housing 71′, which clasps one edgeof the CAI housing 2 in an interlocking manner.

FIGS. 4A and 4B show one embodiment of an optoelectronic module, inwhich the plug housing in FIGS. 2 and 3 is replaced by a naked fiberadaptor 9.

FIG. 4A shows a schematic longitudinal section, corresponding to theillustration shown in FIGS. 1 to 3. FIG. 4B shows a cross section alongthe line IVb-IVb in FIG. 4A.

The CAI housing 2 is in this case pushed into the naked fiber adaptor 9.In principle, the CAI housing 2 and the naked fiber adaptor 9 may alsobe integral. An optical fiber 12 is inserted into the CAI housing 2, andis firmly clamped by means of a clamp 11 in an area 91 of the nakedfiber adaptor 9 which is in the form of a trough.

The inner face of the clamping apparatus 11, the configuration of thetrough shape and the fixing of the clamping apparatus in the naked fiberadaptor 9 are designed so as to prevent the fiber 12 from being pulledback.

Provision is advantageously made for the clamp 11 to cover the open endof the cylindrical CAI housing 2, thus preventing it from becomingdirty.

Instead of fixing in the adaptor area, a clamping apparatus (cuttingclamp) can alternatively be provided in the area of the fiber couplingin the CAI housing itself.

FIG. 5 shows a further embodiment variant with a naked fiber connection,with the CAI housing and the naked fiber adaptor forming an integralmolding 13. The molding 13 is coated with a metallically conductivelayer, thus providing EMC shielding for the transmitting and/orreceiving element. The optical waveguide 12 is fixed by means of aclamping apparatus 14, which clasps the casing of the inserted opticalwaveguide 12.

The molding 13 is firmly connected to the main circuit board 8 by meansof clamping elements 13 a. The lower face 13 b is once again metalized,for electromagnetic shielding.

It should be mentioned that the illustrated embodiment of the CAIhousing may also be combined with a naked fiber connection in the caseof an embodiment in which the submount 3 is arranged alongside the CAIhousing rather than underneath it, as is illustrated in FIGS. 1 and 2.

FIGS. 6A, 6B show a novel plug for a plug arrangement which ispreferably connected to the CAI transceiver 2 in the optoelectronicmodule in FIGS. 1 to 5.

The plug 15 has a housing 151 with two plastic optical fibers 152, whichare separated from one another by 5 mm, and a protective bracket 153.

When the plug 15 is not inserted, the protective bracket 153 ispositioned in front of the end surfaces of the optical fibers 152, sothat the optical fiber ends which project out of the housing 151 areprotected by the protective bracket 153. The protective bracket has acutout 153 a in the area of each of the optical fibers 152.

Furthermore, the protective bracket 153 has three attachment arms 153 b,by means of which it is attached to the housing 151 of the plug suchthat it can move. The attachment arms 153 b are in this case guide inthe corresponding grooves or holders in the housing 151, sprung by meansof their geometric configuration.

As can be seen from the side view in FIG. 6B, the plug 15 has a lockingpart 154 for detachably locking the attachment arms 153 b. An unlockingpart 165, which, for example, is in the form a web on the plug housing71, 71′, 16, allows the lock to be released by lifting the attachmentarms 153 b.

FIG. 6 c shows a plan view of the locking apparatus shown in FIG. 6 balong the direction in which the unlocking part 165 extends, illustratedseparately. As can be seen, the attachment bracket 153 b which isassociated with the unlocking part 165 has a latching tab 153 c whichengages over the unlocking part 165. The latching tab 153 c interactswith the locking part 154 in order to unlock the plug 15 and plughousing 16.

FIG. 7 shows a plug housing 16 associated with the plug 15 shown inFIGS. 6A and 6B.

The plug housing 16 has three steps. A first step 161 is used toaccommodate and hold a CAI housing 2 as shown in FIGS. 1 to 5.

A second step 162 is used to guide the protective bracket 153 of theplug 15. The stop 163 which is formed between the first and second stepsrepresents a stop for the protective bracket 153 of the plug 15. Thethird step 164 is used to guide the actual plug 15 and the housing 151of the plug 15.

The first step is in the form of a circular opening, whose diametercorresponds to the external diameter of the cylinder 24 of the CAIhousing 2. The second step is rectangular, corresponding to the externalshape of the protective bracket 153. The third step is likewiserectangular, corresponding to the cuboid shape of the housing 151associated with the plug 15.

FIG. 8 shows the CAI housing 2 as shown in FIGS. 1 to 5, mounted in theplug housing 16. The plug 15 has at this stage been insertedsufficiently into the plug housing 16 that the protective bracket 153 isresting on the protective bracket stop 163.

FIGS. 7 and 8 likewise show an unlocking part 165 for unlocking theprotective bracket 153, illustrating, likewise schematically, a pluglock 156 by means of which the completely inserted plug 15 is latched tothe plug housing 16. The plug 156 may, of course, also be used forunlocking.

FIG. 9 shows the plug 15 after it has been completely inserted into theplug housing 16. As can be seen from the figure, the protective bracket153 has been inserted further into the housing 151 of the plug 15 fromthe position shown in FIG. 8. The end surface of the optical waveguide152 accordingly projects out of the opening 153 a in the protectivebracket 153, and rests directly on the encapsulation part 21 of the CAIhousing 2. This satisfies the “Kuchiri” criterion.

The invention therefore provides for the protective bracket 153 to bepulled back into the housing 151 of the plug 15 as soon as it reachesthe step stop 163 on the plug housing 16. The movement distance isdesigned precisely such that the fiber 152 is placed in front of theintegrated lens 22 in the encapsulation body 21, and the plug 15 islatched in at the same time. The unlocking mechanism must then bereleased before the plug 15 can be removed from the plug housing 16again.

The shapes and additional structures of the lower attachment arm 153 band of the unlocking part 165 can be designed such that the lowerattachment arm 153 b is forced out of the plug housing 16 while the plug15 is being pulled out. The protective bracket 153 is thus pulled out ofthe housing 151 of the plug 15 until the lower attachment 153 b is onceagain locked on the locking device 154 (see FIG. 6B). This may beachieved with spring assistance or by mechanical parts engaging in oneanother, with these mechanical parts also being moved by the mechanicalpulling movement of the lower attachment arm 153 b.

FIGS. 10 and 11 show the novel plug arrangement, as described above, inconjunction with an optoelectronic module 1 as illustrated in FIGS. 1and 3, respectively. The figures each show the final position, with theplug 15 completely inserted into the plug housing 16.

In this case, with regard to the exemplary embodiment shown in FIG. 10,it should also be noted that the external dimensions of the plug housing16 are such that the plug housing 16 comes to rest on the main circuitboard 8. It should also be mentioned that the transparent encapsulationbody 21 in this exemplary embodiment represents a side wall for thecylindrical CAI housing 2. In this case, the CAI housing 2 is a cylinderwhich is open at both ends, with one end of the cylinder being closed bythe encapsulation body 21. The mount 5 is in this case bent into an Sshape, so that it is completely surrounded by the encapsulation body 21.

With regard to the exemplary embodiment shown in FIG. 11, it should benoted that a preferably metalized protective cap 17 is additionallyconnected in an interlocking manner firstly to the plug housing 16 andsecondly to the main circuit board 8. In this exemplary embodiment, themount 5 is straight.

Because the mount 5 is straight, it is possible to use a version of theCAI housing 2 in which one end of the cylindrical CAI housing 2 isclosed by a housing cover 4, 2 b, as is illustrated in FIGS. 1 to 5, 10and 11.

1. An optoelectronic module a transmitting and/or receiving element, amount for supporting the transmitting and/or receiving element, aholding and coupling part for receiving the transmitting and/orreceiving element and which is at least partially filled with anencapsulation material, and which has a coupling area for receiving anoptical waveguide, and an electrical drive and/or receiving circuitcoupled to the transmitting and/or receiving element, wherein theencapsulation material surrounds the transmitting and/or receivingelement and is located at least partially in the holding and couplingpart, wherein the electrical drive and/or receiving circuit is arrangedoutside the holding and/or coupling part on a submount, which lies on aplane that runs parallel to the longitudinal axis of the coupling area,and wherein the mount is arranged at right angles to the submount. 2.The module as claimed in claim 1, wherein the holding and coupling unitforms a cylindrical cutout, one of whose ends contains the transmittingand/or receiving element, and whose other end forms the coupling areafor an optical waveguide.
 3. The module as claimed in claim 1, whereinthe mount is fitted only with the transmitting and/or receiving elementor with the transmitting element and a monitor diode.
 4. The module asclaimed in 1, wherein the mount is a leadframe, which provides anelectrical link for the transmitting and/or receiving element and iselectrically connected to the submount.
 5. The module as claimed inclaim 4, the leadframe runs at right angles to the longitudinal axis ofthe coupling area, at least in the area of the holding and couplingpart.
 6. The module as claimed in 1, wherein the encapsulation materialforms an integrated lens on the side facing the coupling area.
 7. Themodule as claimed in claim 6, a fiber stop ring is formed in theencapsulation material around the lens and prevents the end surface ofan optical fiber which is inserted into the coupling area from touchingthe lens apex.
 8. The module as claimed in claim 1, wherein the moduleis mechanically coupled to a plug housing.
 9. The module as claimed inwherein the module is mechanically coupled to a naked fiber adaptor. 10.The module as claimed in claim 9, an optical fiber is firmly clamped bymeans of a clamp in an area of the naked fiber adaptor which is in theform of a trough.
 11. The module as claimed in claim 9, the naked fiberadaptor is formed by an extension to the cylindrical coupling area. 12.The module as claimed in claim 1, wherein the submount can be mounted ona main circuit board, in particular by SMD mounting.
 13. The module asclaimed in claim 12, wherein the main circuit board is used as a heatsink for the submount and/or for the electrical drive and/or receivingcircuit which is arranged on the submount, with the submount havingplated holes which are also used for heat conduction.
 14. The module asclaimed in 1, wherein the holding and coupling part and/or the submounthave/has self-coupling structures which allow automatic adjustment ofthe elements with respect to one another and/or with respect to a maincircuit board.
 15. The module as claimed in claim 1, wherein a housingcover is provided and surrounds the submount with the electrical driveand/or receiving circuit, and/or that end of the holding and couplingpart which faces away from the coupling area.
 16. The module as claimedin claim 1, wherein the holding and coupling part and/or the housingcover are/is provided with an electrically conductive layer, and/orare/is composed of a conductive plastic material.
 17. The module asclaimed in claim 1, wherein the holding and coupling part is in the formof a double chamber and, in parallel, separate areas, has firstly atransmitting element and secondly a receiving element, each of which canbe coupled via a separate coupling area to an optical fiber.
 18. Themodule as claimed in claim 1, wherein the submount is arrangedunderneath the coupling area of the holding and coupling part.
 19. Anoptoelectronic module comprising: a submount (5) defining a plane; ahousing (2) mounted on the submount and defining an opening (25); acontrol circuit mounted on the submount such that the control circuit islocated outside of the housing; an optoelectronic transducer (6) mountedinside the housing such that the optoelectronic transducer intersects anoptical axis (29) extending substantially parallel to the plane andthrough the opening; a mount (5) extending substantially perpendicularto the plane between the optoelectronic transducer and the submount; andan encapsulation body (21) disposed inside the housing such that aportion (22,23) of the encapsulation body is located between theoptoelectronic transducer and the opening.
 20. An optoelectronic modulecomprising: a printed circuit board (5) defining a plane; a housing (2)mounted on the printed circuit board and defining an opening (25); acontrol circuit (32) mounted on the printed circuit board such that thecontrol circuit is located outside of the housing; a lens (23) disposedinside the housing such that the lens defines an optical axis (29)extending through the opening and substantially parallel to the planedefined by the printed circuit board; a leadframe (5) located inside ofthe housing and having a fixed end coupled to the control circuit, theleadframe extending substantially perpendicular to the plane defined bythe printed circuit board; and an optoelectronic transducer (6) coupledto the leadframe and positioned inside the housing such that theoptoelectronic transducer intersects the optical axis (29).